Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1988-10-28
1990-03-13
Seidel, Richard K.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228110, 228179, B23K 2000
Patent
active
049077341
ABSTRACT:
A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
REFERENCES:
patent: 2894862 (1959-07-01), Mueller
patent: 3672047 (1972-06-01), Sakamoto et al.
patent: 3733685 (1973-05-01), Kauppila
patent: 3750926 (1973-08-01), Sakamoto et al.
patent: 4739917 (1988-04-01), Baker
Conru H. Ward
Gons Stephen E.
Osborne, Jr. Gordon C.
Phelps, Jr. Douglas W.
Starr Stephen G.
Heinrich Samuel M.
International Business Machines - Corporation
Seidel Richard K.
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