4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Gordon C. Osborne, Jr.

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Method and apparatus for testing integrated circuit chips

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Method and apparatus for testing integrated circuit chips

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Method of bonding gold or gold alloy wire to lead tin solder

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Planarized plastic package modules for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Profile ID: LFUS-PAI-P-109390

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