Method of attachment of a semiconductor slotted lead to a substr

Metal working – Method of mechanical manufacture – Electrical device making

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174 522, 174 524, 22818021, 257735, H05K 334

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056471246

ABSTRACT:
A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

REFERENCES:
patent: 4089041 (1978-05-01), Lockard
patent: 4477970 (1984-10-01), Alexander et al.
patent: 4867715 (1989-09-01), Roth et al.
patent: 4868635 (1989-09-01), Frechette et al.
patent: 4987474 (1991-01-01), Yasuhara et al.
patent: 5180097 (1993-01-01), Zenshi
patent: 5196268 (1993-03-01), Fritz
patent: 5204287 (1993-04-01), McLellan et al.
patent: 5270492 (1993-12-01), Fukui
IBM Tech Discl Bull vol. 32 No. 5B Oct. 1989 pp. 53-54.

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