Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-01-18
2005-01-18
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S612000, C228S245000, C029S841000
Reexamination Certificate
active
06844216
ABSTRACT:
A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
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Ball Michael B.
Cobbley Chad A.
Waddel Marjorie L.
Malsawma Lex H.
Micro)n Technology, Inc.
Smith Matthew
TraskBritt
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