Method of attaching a leadframe to singulated semiconductor...

Details Method of attaching a leadframe to singulated semiconductor... Method of attaching a leadframe to singulated semiconductor...

2005-12-27

2005-12-27

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

Reexamination Certificate

active

06979598

ABSTRACT:
The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.

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