Method of attaching a heat sink to an IC package

Details Method of attaching a heat sink to an IC package Method of attaching a heat sink to an IC package

2005-07-19

2005-07-19

Kim, Paul (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S417000, C029S832000, C029S837000, C174S261000, C361S689000, C361S704000, C361S760000, C361S761000, C361S764000, C083S025000, C083S042000, C083S103000, C264S272110

Reexamination Certificate

active

06918178

ABSTRACT:
An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.

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“Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach”; Cavanaugh, D.;Parts, Hybrids, and Packaging, IEEE Transactions on , vol.: 12 , Issue: 4 , Dec 1976; pp.:29-298.

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