4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Kuan-Neng Liao

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Heat-spread substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Laser method for forming vias

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of attaching a heat sink to an IC package

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Structure and package of a heat spreader substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2532977

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