Method of arranging microspheres with liquid, microsphere...

Details Method of arranging microspheres with liquid, microsphere... Method of arranging microspheres with liquid, microsphere...

2006-10-10

2006-10-10

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S690000, C257SE23021

Reexamination Certificate

active

07119438

ABSTRACT:
A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.

REFERENCES:
patent: 5976965 (1999-11-01), Takahashi et al.
patent: 6107181 (2000-08-01), Kitajima et al.
patent: 2001/0009261 (2001-07-01), Yamamoto et al.
patent: 2001/0015372 (2001-08-01), Yamamoto et al.
patent: 11-008272 (1999-01-01), None
patent: 2000-294676 (2000-10-01), None
patent: 2001-210942 (2001-08-01), None
patent: 2001-223232 (2001-08-01), None

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