4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Japan E M Co., Ltd.

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Method and apparatus for lining up micro-balls

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Method of arranging microspheres with liquid, microsphere...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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