Method of application of electrical biasing to enhance metal...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C205S103000, C205S104000, C205S105000

Reexamination Certificate

active

06913680

ABSTRACT:
A method and associated apparatus includes depositing metal on a plating surface of an object immersed in an electrolyte solution prior to bulk deposition on the plating surface. In one aspect, the method further includes applying a voltage between an anode and the plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface.

REFERENCES:
patent: 2742413 (1956-04-01), Cransberg et al.
patent: 2882209 (1959-04-01), Brown
patent: 3627661 (1971-12-01), Gordon et al.
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 3727620 (1973-04-01), Orr
patent: 3770598 (1973-11-01), Creutz
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4065374 (1977-12-01), Asami et al.
patent: 4092176 (1978-05-01), Kozai et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4113492 (1978-09-01), Sato et al.
patent: 4120759 (1978-10-01), Asami et al.
patent: 4129480 (1978-12-01), Robert
patent: 4315059 (1982-02-01), Raistrick et al.
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4376685 (1983-03-01), Watson
patent: 4396467 (1983-08-01), Anthony
patent: 4405416 (1983-09-01), Raistrick et al.
patent: 4428815 (1984-01-01), Powell et al.
patent: 4435266 (1984-03-01), Johnston
patent: 4489740 (1984-12-01), Rattan et al.
patent: 4496436 (1985-01-01), Inoue
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4518678 (1985-05-01), Allen
patent: 4519846 (1985-05-01), Aigo
patent: 4693805 (1987-09-01), Quazi
patent: 4732785 (1988-03-01), Brewer
patent: 4789445 (1988-12-01), Goffman et al.
patent: 4869971 (1989-09-01), Nee et al.
patent: 4891106 (1990-01-01), Domnikov
patent: 4898647 (1990-02-01), Luce et al.
patent: 5039381 (1991-08-01), Mullarkey
patent: 5055425 (1991-10-01), Leibovitz et al.
patent: 5092975 (1992-03-01), Yamamura et al.
patent: 5155336 (1992-10-01), Gronet et al.
patent: 5162260 (1992-11-01), Leibovitz et al.
patent: 5178813 (1993-01-01), Akatsu et al.
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5224504 (1993-07-01), Thompson et al.
patent: 5230743 (1993-07-01), Thompson et al.
patent: 5252807 (1993-10-01), Chizinsky
patent: 5256274 (1993-10-01), Poris
patent: 5259407 (1993-11-01), Tuchida et al.
patent: 5290361 (1994-03-01), Hayashida et al.
patent: 5302256 (1994-04-01), Miura et al.
patent: 5316974 (1994-05-01), Crank
patent: 5328589 (1994-07-01), Martin
patent: 5349978 (1994-09-01), Sago et al.
patent: 5368711 (1994-11-01), Poris
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5384640 (1995-01-01), Wong
patent: 5415890 (1995-05-01), Kloiber et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5447615 (1995-09-01), Ishida
patent: 5454930 (1995-10-01), Miura et al.
patent: 5456819 (1995-10-01), Lashmore et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5516414 (1996-05-01), Glafenhein et al.
patent: 5528118 (1996-06-01), Lee
patent: 5608943 (1997-03-01), Konishi et al.
patent: 5625170 (1997-04-01), Poris
patent: 5651865 (1997-07-01), Sellers
patent: 5670034 (1997-09-01), Lowery
patent: 5705223 (1998-01-01), Bunkofske
patent: 5723028 (1998-03-01), Poris
patent: 5730890 (1998-03-01), Bickford et al.
patent: 5838121 (1998-11-01), Fairbairn et al.
patent: 5882498 (1999-03-01), Dubin et al.
patent: 5885469 (1999-03-01), Kholodenko et al.
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6071388 (2000-06-01), Uzoh
patent: 6074544 (2000-06-01), Reid et al.
patent: 6093291 (2000-07-01), Izumi et al.
patent: 6113771 (2000-09-01), Landau et al.
patent: 6133061 (2000-10-01), Sonoda
patent: 6162344 (2000-12-01), Reid et al.
patent: 6174425 (2001-01-01), Simpson et al.
patent: 6197181 (2001-03-01), Chen
patent: 6203582 (2001-03-01), Berner et al.
patent: 6203684 (2001-03-01), Taylor et al.
patent: 6210555 (2001-04-01), Taylor et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6251236 (2001-06-01), Stevens
patent: 6254760 (2001-07-01), Shen et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6261433 (2001-07-01), Landau
patent: 6261733 (2001-07-01), Coppens et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6277263 (2001-08-01), Chen
patent: 6290833 (2001-09-01), Chen
patent: 6303014 (2001-10-01), Taylor et al.
patent: 6319384 (2001-11-01), Taylor et al.
patent: 6340633 (2002-01-01), Lopatin et al.
patent: 6344419 (2002-02-01), Forster et al.
patent: 6350366 (2002-02-01), Landau et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395101 (2002-05-01), Scranton et al.
patent: 6399479 (2002-06-01), Chen et al.
patent: 6409903 (2002-06-01), Chung et al.
patent: 6423636 (2002-07-01), Dordi et al.
patent: 6432821 (2002-08-01), Dubin et al.
patent: 6432832 (2002-08-01), Miller et al.
patent: 6440291 (2002-08-01), Henri et al.
patent: 6551484 (2003-04-01), Hey et al.
patent: 6551488 (2003-04-01), Hey et al.
patent: 6557237 (2003-05-01), Olgado
patent: 6565729 (2003-05-01), Chen et al.
patent: 6571657 (2003-06-01), Olgado et al.
patent: 6582578 (2003-06-01), Dordi et al.
patent: 6585876 (2003-07-01), Dordi et al.
patent: 6632345 (2003-10-01), Chen
patent: 6638410 (2003-10-01), Chen et al.
patent: 6662673 (2003-12-01), Olgado
patent: 2001/0015321 (2001-08-01), Reid et al.
patent: 2002/0011415 (2002-01-01), Hey et al.
patent: 932 709 (1955-09-01), None
patent: 1 050 902 (2000-11-01), None
patent: 1 160 846 (2001-12-01), None
patent: 520 563 69 (1977-09-01), None
patent: 58182823 (1983-10-01), None
patent: 61-7291 (1986-01-01), None
patent: 63118093 (1988-05-01), None
patent: 04280993 (1992-10-01), None
patent: 6-17291 (1994-01-01), None
patent: 4-141395 (1994-05-01), None
patent: 443 108 (1968-11-01), None
patent: WO 97/12079 (1997-04-01), None
patent: 99/25902 (1999-05-01), None
patent: 99/25903 (1999-05-01), None
patent: 99/25904 (1999-05-01), None
patent: WO 99/25905 (1999-05-01), None
patent: 99/26275 (1999-05-01), None
patent: WO-99/47731 (1999-09-01), None
patent: WO 9954527 (1999-10-01), None
patent: 99/54527 (1999-10-01), None
patent: WO 00/20662 (2000-04-01), None
patent: WO 00/22193 (2000-04-01), None
patent: 01/90446 (2001-11-01), None
Holm, R., “Electric Contacts Theory and Application” Springer-Verlag New York Inc. 1967, 26 pages.
Pitney, K.E., “NEY Contact Manual,” Electrical Contacts for Low Energy Uses, 1973, 19 pages. No Month Avail.
Singer, P., “Wafer Processing,” Semiconductor International, Jun. 1998, 1 page.
Singer, P., “Tantalum, Copper and Damascene: The Future of Interconnects,” Semiconductor International, Jun. 1998, 6 pages.
USSN 09/569,833 (Dordi, et al.), filed May 11, 2000.
European Search Report, EP Application No. 01303981.3, Oct. 22, 2003.
PCT Written Opinion; PCT US01/15200; Feb 5, 2004.
F. Lowenheim, Electroplating; McGraw-Hill Book Company, Jan. 8, 1979.
U.S. Appl. No. 09/614,407, Zheng, et al.
U.S. Appl. No. 09/569,833, Gandikota, et al.
Olgado, et al. “Stable Cell Platform,” filed Sep. 29, 2000; USSN 09/676,362.
Dordi, et al. “Flow Diffuser to be Used in Electro-Chemical Plating System,” filed Dec. 5, 2000; USSN 09/731,326.
Olgado, “Linear Motion Apparatus and Associated Method,” filed Oct. 16, 2000; USSN 09/684,500.
Dordi, et al. “Method and Associated Apparatus for Tilting a Substrate Upon Entry for Metal Deposition,” filed Oct. 3, 2000; USSN 09/678,947 (2601.P5).
Olgado, et al. “Multiple Blade Robot Adjustment Apparatus and Associated Method,” filed Sep. 18, 2000; USSN 09/664,607 (2601.P3).
Olgado, “Removable Modular Cell for Electro-Chemical Plating,” filed Sep. 15, 2000; USSN 09/663,814 (2601.P2).
Colombo, “Wafer Back Surfaces Film Removal,” Central R&D, SGS-Thomson Microelectronics, Agate Italy.
International Search Report for PCT Application US01/15200 dated Mar. 11, 2003. (AMAT/4582.PC).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of application of electrical biasing to enhance metal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of application of electrical biasing to enhance metal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of application of electrical biasing to enhance metal... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3368533

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.