Method of and apparatus for securing and cooling/heating a wafer

Details Method of and apparatus for securing and cooling/heating a wafer Method of and apparatus for securing and cooling/heating a wafer

1993-11-18

1995-10-17

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118725, 118728, C23C 1600

Patent

active

054586879

ABSTRACT:
A wafer processing apparatus comprises a vacuum processing chamber, and a wafer holder disposed within the vacuum processing chamber to hold a wafer to be processed fixedly thereon by electrostatic attraction. A cooling or heating gas is supplied into the space between the surface of the wafer holder and the backside of a wafer set on the wafer holder to cool or heat the wafer. In case the electrostatic attraction disappears accidentally due to, for example, power failure, the cooling or heating gas in the space between the surface of the wafer holder and the backside of the wafer set on the wafer holder is discharged quickly upon the disappearance of the electrostatic attraction between the wafer holder and the wafer to prevent the wafer being caused to float and being dislocated by the pressure of the cooling or heating gas existing in the space between the surface of the wafer holder and the backside of the wafer.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 4457359 (1984-07-01), Holden
patent: 4527620 (1985-07-01), Pedersen
patent: 4565601 (1986-01-01), Kakehi
patent: 4771730 (1988-09-01), Tezuka
patent: 4911812 (1990-03-01), Kudo
patent: 5033538 (1991-07-01), Wagner
patent: 5213349 (1993-05-01), Elliott
patent: 5290381 (1994-03-01), Nozawa
patent: 5362361 (1994-11-01), Tatsumi
patent: 5368685 (1994-11-01), Kumihashi

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