Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2005-06-28
2005-06-28
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345240, C156S345290, C156S345320, C156S345350, C118S719000, C414S939000
Reexamination Certificate
active
06911112
ABSTRACT:
A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.
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Hassanzadeh Parviz
Moore Karla
Samsung Electronics Co,. Ltd.
Volentine Francos & Whitt PLLC
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