Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Patent
1998-06-05
2000-08-22
Whitehead, Jr., Carl
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
438680, 438782, H01L 2131
Patent
active
061072125
ABSTRACT:
A method of and an apparatus for manufacturing semiconductor devices by transporting wafers by way of an evacuated load lock chamber into a reaction furnace, which conducting processing under heating at a reduced pressure, wherein the wafers are entered into the load lock chamber and, subsequently, wafers are heated simultaneously with evacuation of the load lock chamber. Time for entering wafers from the load lock chamber into the reaction chamber can be shortened thereby shortening the processing time per one batch.
REFERENCES:
patent: 4824518 (1989-04-01), Hayakawa et al.
patent: 4960720 (1990-10-01), Shimbo
patent: 5135608 (1992-08-01), Okutani
patent: 5259918 (1993-11-01), Akbar et al.
patent: 5286296 (1994-02-01), Sato et al.
patent: 5286334 (1994-02-01), Akbar et al.
patent: 5302855 (1994-04-01), Matsumoto et al.
patent: 5388944 (1995-02-01), Takanabe et al.
patent: 5433785 (1995-07-01), Saito
patent: 5589421 (1996-12-01), Miyashita et al.
patent: 5607511 (1997-03-01), Meyerson
patent: 5700719 (1997-12-01), Yuzurihara et al.
Guerrero Maria
Jr. Carl Whitehead
Sony Corporation
LandOfFree
Method of and apparatus for manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of and apparatus for manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and apparatus for manufacturing semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-580887