Method of and apparatus for inspecting mounting of chip componen

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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356372, 364552, G01B 1100

Patent

active

049782240

ABSTRACT:
To determine whether chip components are properly mounted on a printed circuit board, two sets of slit light beams for projecting slit line images in mutually perpendicular directions are alternately made incident thereon diagonally from above. Edges of the mounted chip components produce discontinuities in the projected slit beam image patterns such that the positions, sizes, orientations, etc. of individual mounted components can be calculated from image data obtained from viewing positions above the circuit board by a camera or the like. Since it can be easily ascertained how the slit line image pattern should appear if proper components are properly mounted, an analysis of the calculated data can indicate whether the chip components are properly mounted on the tested printed circuit board.

REFERENCES:
patent: 4578810 (1986-03-01), MacFarlane et al.
patent: 4692690 (1987-09-01), Hara et al.
patent: 4728195 (1988-03-01), Silver
patent: 4799175 (1989-01-01), Sano et al.
Y. Kakinoki, et al., "Loaded Printed Circuit Board Inspection with 3-D Measurement of Component Orientation", (Institute of Electronic Information and Communication Engineers), PRL85-34, pp. 67-75.
Cheng; "Design for an Automated Recognition System for Multilayer Circuit Board Testing"; SPIE, vol. 255, Practical Electro-Optical Inst. and Techniques (1980) pp. 40-42.
T. Masaki, et al., "Solder Inspection System for Surface Mount Board", Pros. Spring (1988) General Meeting Institute of Electronic Information and Communication Engineers, pp. 2-247.

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