Method of and apparatus for coating a wafer with a minimal layer

Details Method of and apparatus for coating a wafer with a minimal layer Method of and apparatus for coating a wafer with a minimal layer

1998-07-10

2000-09-05

Edwards, Laura

Coating apparatus

Program, cyclic, or time control

118712, 118 52, 118 56, 118321, 118323, B05C 1102, B05C 1110, B05B 1304

Patent

active

061136972

ABSTRACT:
In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.

REFERENCES:
patent: 5070813 (1991-12-01), Sakai et al.
patent: 5958517 (1999-09-01), Poag et al.

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