Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-25
2008-03-25
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S681000, C977S742000, C977S745000, C427S248100, C427S249100
Reexamination Certificate
active
07348274
ABSTRACT:
A method of aligning carbon nanotubes (CNTs) and a method of manufacturing a field emission device (FED) using the same, wherein a mold having an intaglio pattern is prepared, an aqueous solution containing an amphiphilic organic material and the CNTs are coated on a surface of a substrate, the mold is adhered to the substrate surface to cause the aqueous solution to flow into the intaglio pattern by a capillary force, and the mold is removed from the substrate surface to vertically align the CNTs on the substrate surface.
REFERENCES:
patent: 6924335 (2005-08-01), Fan et al.
patent: 2003/0096104 (2003-05-01), Tobita et al.
patent: 2004/0173506 (2004-09-01), Doktycz et al.
Bae Min-Jong
Chung Deuk-Seok
Oh Tae-Sik
Bushnell , Esq. Robert E.
Kim Su C.
Lee Hsien-Ming
Samsung SDI & Co., Ltd.
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