Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-12-12
1990-03-06
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156664, 156668, 427 38, 427299, 427399, 427 541, B44C 122, C03C 1500, B08B 312, D05D 306
Patent
active
049063286
ABSTRACT:
A processing apparatus and method utilizing a single process chamber to remove organics and metallic contaminates, remove native oxides, oxidize by heat and a oxidizing source, depositing a layer over the oxide formed with the capability of providing an source of additional ultraviolet light.
REFERENCES:
patent: 4439244 (1984-03-01), Allevato
patent: 4493977 (1985-01-01), Arai et al.
patent: 4687542 (1987-08-01), Davis et al.
patent: 4689112 (1987-08-01), Barsin
patent: 4715921 (1987-12-01), Maher et al.
Burris James B.
Davis Cecil J.
Freeman Dean W.
Loewenstein Lee M.
Barndt B. Peter
Comfort James T.
Powell William A.
Sharp Melvin
Texas Instruments Incorporated
LandOfFree
Method for wafer treating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for wafer treating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for wafer treating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-45522