Method for treating semiconductor wafers with corona charge and

Details Method for treating semiconductor wafers with corona charge and Method for treating semiconductor wafers with corona charge and

1997-09-05

2000-10-03

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Ionized irradiation

438795, H01L 21477, H01L 2126

Patent

active

061272892

ABSTRACT:
A method of treating the surface of a semiconductor wafer is disclosed for making the wafer resistant to particle adhesion, the method involving the application of a uniform corona charge to the wafer surface. The corona charge is deposited on the wafer using commercially available tools, and if necessary, it may be later removed by immersing the wafer in deionized water or by depositing a compensating corona charge over the wafer of opposite polarity relative to the originally-applied charge.

REFERENCES:
patent: 4007294 (1977-02-01), Woods et al.
patent: 4086650 (1978-04-01), Davis et al.
patent: 5075257 (1991-12-01), Hawk et al.
patent: 5316970 (1994-05-01), Batchelder et al.
patent: 5485091 (1996-01-01), Verkuil
patent: 5773989 (1998-06-01), Edelman et al.
Inaba et al., "Neutralization of Wafer Charging in Nitrogen Gas", IEEE Transactions on Semiconductor Manufacturing, vol. 5, No. 4, pp. 359-367, Nov. 1992.

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