Method for transfer molding standard electronic packages and app

Details Method for transfer molding standard electronic packages and app Method for transfer molding standard electronic packages and app

1995-10-16

1997-11-18

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257667, 257693, 257787, 437214, 437219, 361737, 26427217, H01L 2302, H01L 23495

Patent

active

056891377

ABSTRACT:
A method for transfer molding a standard electronic package and an apparatus resulting from such method. A seal is formed between a portion of the mold platens of the mold and a portion of a printed circuit board adjacent to electrical contacts along at least one side of the printed circuit board. After the apparatus is removed from the mold, a protective cap is placed over the electrical contacts.

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patent: 5132778 (1992-07-01), Juskey et al.
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patent: 5244840 (1993-09-01), Kodai et al.
Zbranek, Jr. "PCMCIA Process Development", Circuits Assembly (Mar. 1995) pp. 46-50.
Markstein, "Effective Shielding Defeats EMI", Electronic Packaging & Production, (Feb. 1995) pp. 76-80.
Anderson, PCMCIA System Architecture (1994) pp. 21-28, Mindshare, Inc., Richardson, TX.
Freiberger, "PCMCIA Testing and Final Assembly" Circuits Assembly (Mar. 1995) pp. 42-45.
Spraylat Corporation, sales brochure, Mt. Vernon, NY.
Methode Electronics, Inc. sales brochure, Chicago, IL.
Berg Electronics, sales brochure (Aug. 1993).
Minico, sales brochure (1991).

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