4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Patrick O. Weber

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Apparatus for encapsulating electronic packages

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Apparatus for encapsulating electronic packages

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with molded underfill

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with molded underfill

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Chip package with molded underfill

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Patrick O. Weber does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Patrick O. Weber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patrick O. Weber will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-84186

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure