Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2003-04-15
2010-11-02
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S780000, C438S778000, C257SE21245, C257SE21244
Reexamination Certificate
active
07825029
ABSTRACT:
A method for the patterned coating of a substrate with at least one surface is provided. The method is suitable for the rapid and inexpensive production of precise patterns. The method includes the steps of: producing at least one negatively patterned first coating on the at least one surface, depositing at least one second layer, which includes a material with a vitreous structure, on the surface, and at least partially removing the first coating.
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Bieck Florian
Leib Jurgen
Mund Dietrich
Fourson George
Ohlandt Greeley Ruggiero & Perle L.L.P.
Schott AG
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