Method for the preparation of highly heat-resistant relief struc

Details Method for the preparation of highly heat-resistant relief struc Method for the preparation of highly heat-resistant relief struc

1981-06-04

1982-12-28

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430 17, 430296, 430302, 430306, 430311, 430322, 430270, 430280, 20415915, 20415918, 528 73, 528287, 528289, 528291, 528337, 528341, G03C 500

Patent

active

043662307

ABSTRACT:
The invention relates to a method for the preparation of highly heat-resistant relief structures with a base of polymers of heterocyclic structure by applying radiation-sensitive soluble polymer precursor stages in the form of a film or foil to a substrate, irradiating the film or foil through negative patterns with actinic light or by deflecting a light, electron or ion beam, removing the non-irradiated film or foil portions and, optionally, by subsequent annealing, as well as to the use of relief structures prepared in this manner. It is provided to use as polymer precursor stages addition products of cyclic carboxylic-acid anhydrides with hydroxyl group-containing compounds, where the hydroxyl group-containing compounds represent addition products of olefinically unsaturated mono-epoxides on carboxyl group-containing prepolymers of polyimides, polyisoindoloquinazoline diones, polyoxazine diones and polyquinazoline diones or on amino group-containing prepolymers of polyimidazoles and polyimidazopyrrolones or on hydroxyl group-containing prepolymers of polyoxazoles. The relief structures prepared by the method according to the invention are suitable especially for use as resists, surface coating materials and insulating materials.

REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.
patent: 3964908 (1976-06-01), Bargon et al.
patent: 4121936 (1978-10-01), Matsuda et al.

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