Method for the preparation of heat-resistant relief structures u

Details Method for the preparation of heat-resistant relief structures u Method for the preparation of heat-resistant relief structures u

1982-04-28

1983-07-26

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430190, 430192, 430322, 430330, G03C 500

Patent

active

043954820

ABSTRACT:
The invention relates to heat-resistant positive resists based upon precursor stages of highly heat-resistant polymers and light-sensitive diazoquinones, as well as to a method for preparing heat-resistant relief structures of such positive resists. The positive resists of the type mentioned are developed in such a manner that they are heat-resistant as well as have a long storage life and are easily processed. The invention provides for the use of oligomer and/or polymer precursor stages of polyoxazoles in the form of polycondensation products of aromatic and/or heterocyclic dihydroxydiamino compounds and dicarboxylic acid chlorides or esters. The positive resists according to the invention are suitable especially for applications in microelectronics.

REFERENCES:
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4326018 (1982-04-01), Jargiello
patent: 4339521 (1982-07-01), Ahne et al.

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