Method for the application of a scratch protection layer and an

Details Method for the application of a scratch protection layer and an Method for the application of a scratch protection layer and an

1999-07-30

2000-10-03

Diamond, Alan

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

2041921, 20419212, 20419215, 20419216, 20419226, 20419228, 20429802, 20429806, 20429807, 20429812, 20429823, 20429825, 20429826, 20429828, 118723E, 118723R, 118723ER, 118729, 118730, 118 75, 427569, 427585, 427590, C23C 1644, C23C 1734

Patent

active

061267929

ABSTRACT:
For the application of a scratch protection layer on plastic substrates, a plasma is produced by the plasma CVD method, away from the individual plastic substrate, in an excitation gas, and this excitation gas is supplied through a tube to the plastic substrate. Subsequently, an antireflection layer is applied by means of a gas flow sputter source. The apparatus provided for this has a plasma CVD chamber (1) and a gas flow sputter chamber (2), next to one another. The plastic substrates (7,8) to be coated are transported from the plasma CVD chamber (2) to the gas flow sputter chamber (1) with the aid of a transporting device (3), designed as a turning plate.

REFERENCES:
patent: 4234622 (1980-11-01), DuBuske et al.
patent: 5330633 (1994-07-01), Matsumoto et al.
patent: 5466296 (1995-11-01), Misiano et al.
IBM Technical Disclosure Bulletin, "Thin Films Deposition System," vol. 38, No. 2, pp. 187-188.
JP 62-174382, Patent Abstracts of Japan, C-470, Jan. 22, 1988, vol. 12, No. 22.

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