Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2005-06-09
2009-10-13
Chen, Bret (Department: 1792)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S255290, C427S314000, C438S775000
Reexamination Certificate
active
07601404
ABSTRACT:
A method for switching decoupled plasma nitridation (DPN) processes of different doses, which is able to decrease the switching time, is provided. According to the method, a dummy wafer is inserted into a chamber, a process gas introduced is ignited into plasma, and then a DPN doping process of the next dose is performed on the dummy wafer. The nitrogen concentration of the chamber is thus adjusted rapidly to switch to the DPN process of the next dose. In addition, after several cycles of the above steps are repeated, a dummy wafer is inserted into the chamber, and a complete DPN process of the next dose is performed on the dummy wafer. This process is performed several times before switching to the next DPN process.
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Chan Shu-Yen
Chen Chung-Yih
Chiang Chen-Kuo
Wang Yun-Ren
Yen Ying-Wei
Chen Bret
Hsu Winston
United Microelectronics Corp.
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