Method for removal of photoresist using sparger

Details Method for removal of photoresist using sparger Method for removal of photoresist using sparger

2005-03-08

2005-03-08

Mills, Gregory (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Recycling, regenerating, or rejunevating etchant

C216S083000, C438S689000

Reexamination Certificate

active

06863836

ABSTRACT:
A method of removing photoresist from semiconductor wafers through the use of a sparger plate. According to the inventive method, at least one semiconductor wafer is positioned in a process tank above the sparger plate. A mixture of ozone and deionized water is introduced into the process tank at a position below the sparger plate. The mixture of ozone and deionized water is then introduced across the wafer via the sparger plate at an increased flow velocity while the wafer is submerged in the mixture of deionized water and ozone.

REFERENCES:
patent: 5464480 (1995-11-01), Matthews
patent: 6080531 (2000-06-01), Carter et al.
patent: 6187216 (2001-02-01), Dryer et al.
patent: 2000164552 (2000-06-01), None

Affiliated with

Also associated with

Rating

Method for removal of photoresist using sparger does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for removal of photoresist using sparger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for removal of photoresist using sparger will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3389994