Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-11-21
1993-06-22
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156656, 156664, 156665, 156668, H01L 2100
Patent
active
052214249
ABSTRACT:
A process is described for removing from an integrated circuit structure photoresist remaining after a metal etch which also removes or inactivates a sufficient amount of any remaining chlorine residues remaining from the previous metal etch to inhibit corrosion of the remaining metal for at least 24 hours. The process includes a first stripping step associated with a plasma, using either O.sub.2 gas and one or more fluorocarbon gases, or O.sub.2 gas and N.sub.2 gas; followed by a subsequent step using a combination of H.sub.2 O.sub.2 /H.sub.2 O vapors, O.sub.2 gas, and optionally N.sub.2 gas associated with a plasma. Preferably, the plasma is generated in a microwave plasma generator located upstream of the stripping chamber, and the stripping gases pass through this generator so that reactive species produced from the gases in the plasma enter the stripping chamber.
REFERENCES:
patent: 3799803 (1974-03-01), Kraus et al.
patent: 4325984 (1982-04-01), Galfo et al.
patent: 4501061 (1985-02-01), Wonnacott
patent: 4547260 (1985-10-01), Takada et al.
patent: 4668335 (1987-05-01), Mockler et al.
patent: 4695327 (1987-09-01), Grebinski
patent: 4778536 (1988-10-01), Grebinski
patent: 4867799 (1989-09-01), Grebinski
patent: 4985113 (1991-01-01), Fujimoto et al.
patent: 5007981 (1991-04-01), Kawasaki et al.
patent: 5068040 (1991-11-01), Jackson
patent: 5100476 (1992-03-01), Mase et al.
Applied Materials Inc.
Dang Thi
Taylor John P.
LandOfFree
Method for removal of photoresist over metal which also removes does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for removal of photoresist over metal which also removes , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for removal of photoresist over metal which also removes will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1439243