Method for reducing or eliminating de-lamination of...

Details Method for reducing or eliminating de-lamination of... Method for reducing or eliminating de-lamination of...

2006-05-09

2006-05-09

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S011000, C451S041000, C451S060000, C451S285000

Reexamination Certificate

active

07040952

ABSTRACT:
A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribution across the width of a belt pad. The slurry distribution is maintained in a manner that prevents de-lamination of a wafer film having weak adhesion characteristics. Thus, the pulsed polishing head rotation implemented by the method reduces de-lamination of low-K material film layers during the CMP process.

REFERENCES:
patent: 5582534 (1996-12-01), Shendon et al.
patent: 5759918 (1998-06-01), Hoshizaki et al.
patent: 5770521 (1998-06-01), Pollock
patent: 5851136 (1998-12-01), Lee
patent: 5938884 (1999-08-01), Hoshizaki et al.
patent: 6102776 (2000-08-01), Boggs et al.
patent: 6315857 (2001-11-01), Cheng et al.
patent: 6464574 (2002-10-01), Halley
patent: 6843711 (2005-01-01), Muldowney
patent: 2003/0203709 (2003-10-01), Peng et al.

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