Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2007-12-04
2007-12-04
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S751000, C257SE21215, C257SE21316
Reexamination Certificate
active
10465850
ABSTRACT:
A semiconductor manufacturing method that includes providing a substrate, providing a layer of material over the substrate, providing a layer of photoresist over the material layer, patterning and defining the photoresist layer, depositing a layer of polymer over the patterned and defined photoresist layer, wherein the layer of polymer is conformal and photo-insensitive, and etching the layer of polymer and the layer of material.
REFERENCES:
patent: 6669858 (2003-12-01), Bjorkman et al.
patent: 6750150 (2004-06-01), Chung et al.
patent: 6770567 (2004-08-01), Ko et al.
Chung Henry Wei-Ming
Liang Ming-Chung
Tsai Shin-Yi
Akin Grump Strauss Hauer & Feld LLP
Macronix International Co. Ltd.
Trinh (Vikki) Hoa B
Weiss Howard
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