Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2009-11-02
2011-11-08
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S126000
Reexamination Certificate
active
08053336
ABSTRACT:
A method of forming an integrated circuit structure including providing a wafer comprising a front surface and a back surface, wherein the wafer comprises a chip; forming an opening extending from the back surface into the chip; filling an organic material in the opening, wherein substantially no portion of the organic material is outside of the opening and on the back surface of the wafer; and baking the organic material to cause a contraction of the organic material.
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patent: 523905 (1976-10-01), None
Cheng Chun-Ren
Lee Jiou-Kang
Peng Jung-Huei
Tsai Shang-Ying
Wu Ting-Hau
Booth Richard A.
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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