Method for reducing chemical interaction between copper features

Details Method for reducing chemical interaction between copper features Method for reducing chemical interaction between copper features

1989-03-24

1992-01-14

Hamilton, Cynthia

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430272, 430277, 430954, 430961, 430311, G03F 709, G03F 726, G03F 7038

Patent

active

050810057

ABSTRACT:
The surface of metallic features are coated with a desensitizer composition comprising an amino-silane to reduce the likelihood of chemical interaction between the metallic feature and a photosensitive functional group that is included in a dielectric composition that is coated over the metallic features. The chemical interaction adversely affects the photosensitivity of the dielectric composition and, thus, inhibits the formation of complete and well defined via interconnections through the dielectric composition.

REFERENCES:
patent: 3508983 (1970-04-01), Origer et al.
patent: 3520683 (1970-07-01), Kerwin
patent: 3615538 (1971-10-01), Peters et al.
patent: 4732858 (1988-03-01), Brewer et al.
patent: 4786569 (1988-11-01), Rohde et al.

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