Method for reducing bonding pad loss using a capping layer when

Details Method for reducing bonding pad loss using a capping layer when Method for reducing bonding pad loss using a capping layer when

1998-05-11

1999-11-16

Utech, Benjamin

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438702, 438706, 438720, H01L 2100

Patent

active

059857650

ABSTRACT:
A method for reducing bonding pad loss is achieved using a capping layer when contact openings are etched to the bonding pads, while concurrently etching much deeper fuse openings to the substrate. Bonding pads are used on the top surface of integrated circuit semiconductor chips to provide external electrical connections for I/Os and power. And fuses are used in the underlying insulating layers to remove redundant defective circuit elements and thereby repair defective chips. It is desirable (cost effective) to etch the contact openings in the passivation layer to the bonding pads near the top surface on the chip and to concurrently etch the much deeper fuse openings in the thick underlying insulating layers over the fuses. However, because of the difference in etch depth of the two types of openings, the bonding pads composed of Al/Cu are generally overetched causing bond-pad reliability problems. This invention uses a novel process in which a capping layer, having a low etch rate, is formed on the bonding pads to prevent overetching while the fuse openings are etched to the desired depth in the thicker insulating layers.

REFERENCES:
patent: 5290588 (1994-03-01), Romero et al.
patent: 5384284 (1995-01-01), Doan et al.
patent: 5403777 (1995-04-01), Bryant et al.
patent: 5705428 (1998-01-01), Liu et al.
patent: 5716218 (1998-02-01), Fornworth et al.
patent: 5789303 (1998-08-01), Leung et al.
patent: 5821160 (1998-10-01), Rodriguez et al.
patent: 5891808 (1999-04-01), Chang et al.

Affiliated with

Also associated with

Rating

Method for reducing bonding pad loss using a capping layer when does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for reducing bonding pad loss using a capping layer when , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for reducing bonding pad loss using a capping layer when will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1324416