Method for reducing assembly-induced stress in a...

Details Method for reducing assembly-induced stress in a... Method for reducing assembly-induced stress in a...

2007-01-23

2007-01-23

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Combined with the removal of material by nonchemical means

Reexamination Certificate

active

11072112

ABSTRACT:
A method and apparatus for mounting semiconductor die and integral heat spreader are disclosed. In one embodiment, thermal expansion of the integral heat spreader is restricted by physical constraints during the process of heating interface material that bonds the integral heat spreader and semiconductor die together. In an alternative embodiment, thermal expansion of the integral hat spreader is restricted by applying an external compressive force to the integral heat spreader while heating interface material that bonds the integral heat spreader and semiconductor die together.

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patent: 6015722 (2000-01-01), Banks et al.
patent: 6117797 (2000-09-01), Hembree
patent: 6617683 (2003-09-01), Lebonheur et al.
patent: 6724078 (2004-04-01), Sur et al.
patent: 2005/0151268 (2005-07-01), Boyd et al.

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