4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Combined with the removal of material by nonchemical means

Nitin A. Deshpande

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Method for reducing assembly-induced stress in a...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Method, system, and apparatus for gravity assisted chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3068893

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