Method for producing thin film multilayer substrate, and method

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

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430311, 250562, 250563, 356237, G01N 2188, G01N 2164

Patent

active

052780120

ABSTRACT:
A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.

REFERENCES:
patent: 4538909 (1985-09-01), Bible et al.
patent: 4816686 (1989-03-01), Hara et al.
patent: 4999511 (1991-03-01), Kohno

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