Method for producing surface micromechanical structures, and...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Details

C438S053000, C257S254000, C257S417000

Reexamination Certificate

active

06867061

ABSTRACT:
A method is described for producing surface micromechanical structures having a high aspect ratio, a sacrificial layer being provided between a substrate and a function layer, trenches being provided by a plasma etching process in the function layer, at least some of these trenches exposing surface regions of the sacrificial layer. To increase the aspect ratio of the trenches, an additional layer is deposited on the side walls of the trenches in at least some sections, but not on the exposed surface regions of the sacrificial layer. In addition, a sensor is described, in particular an acceleration sensor or a rotational rate sensor.

REFERENCES:
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patent: 06 163872 (1994-06-01), None
patent: WO 94 18697 (1994-08-01), None
patent: WO 96 08036 (1996-03-01), None

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