Method for producing resist substrates

Details Method for producing resist substrates Method for producing resist substrates

2004-02-24

2010-02-02

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Electron beam imaging

C430S510000, C430S511000, C430S512000, C430S942000

Reexamination Certificate

active

07655381

ABSTRACT:
The invention relates to a method for producing a substrate having a resist layer in the form of a relief structure, which represents a diffraction structure. The resist layer at least in certain areas adjoins a conductive layer, which scatters the primary electrons and/or produces secondary electrons when the resist layer is exposed by means of an electron beam. With this method the material of the resist layer and the conductive layer and the exposure parameters are adjusted to each other such that the resist layer is also exposed outside the area impinged with the electron beam such that the flanks of the relief structure obtain an inclined form.

REFERENCES:
patent: 3961102 (1976-06-01), Ballantyne et al.
patent: 6344275 (2002-02-01), Katsumura et al.
patent: 6569578 (2003-05-01), Nozaki et al.
patent: 1341928 (2002-03-01), None
patent: 1156138 (2001-11-01), None
M. Gentili et al: “Fabrication of controlled slope attenuated phase-shift X-ray masks for 250 nm synchrotron lithography” Journal of Vacuum Science and Technology: Part B, American Institute of Physics, New York, US, vol. 12, No. 6, Nov. 1, 1994, pp. 3954-3958, XP000497202, ISSN: 1071-1023.
H. Itoh et al: “Charging effects on trilevel resist and metal layer in electron-beam lithograph”, Journal of Vacuum Science & Technology B, Microelectronics Processing and Phenomena, USA, vol. 9, No. 6, 1991, pp. 3039-3042, XP002303455, ISSN: 0734-211X.
Ernst-Bernhard Kley: “Continuous profile writing by electron and optical lithography”, Microelectronic Engineering, Elsevier Publishers BV., Amsterdam, NL, vol. 34, Dec. 1, 1997, pp. 261-298, XP004108294, ISSN: 0167-9317.
“Electron Beam/Optical Stepper Mixed Lithography” (Liu Ming, Chen Baoquin, Liu Xiao-wei, Wei Lin-peng, Wu De-xin; No. 1, Microfabrication Technology, 2002-2-3-31), pp. 13-17.
“Digital pixel hologram by means of e-beam lithography” (Wang tianji, Li Yaotang, Yang Shining, Zhang Shichao, Fan Shaowu, Wen Huanrong, W.H. Hong, N. K. Bao, E. Y. B. Pun, P.S. Chung, Laser Journal (vol. 20, No. 3, 1999), pp. 34, 35 and 57.

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