Method for producing bumps on an electrical component

Details Method for producing bumps on an electrical component Method for producing bumps on an electrical component

2005-10-17

2008-11-11

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21514

Reexamination Certificate

active

07449405

ABSTRACT:
A method for producing contacts in the form of bumps on a component that comprises a base body includes, first, positioning a template on the base body. Through holes are produced through the template. By filling the through holes with an electrically conductive material and subsequently hardening, fillers are produced. Bumps for the external electrical contact of the fillers are, then, produced directly on the surfaces of the fillers.

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H. Schaumburg “Keramik”, B.G. Teubner Verlag Stuttgart, 1994, pp. 351 to 352 and 563.

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