Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-02-07
2006-02-07
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
06995083
ABSTRACT:
Disclosed is a method for producing an electrical and/or mechanical connection between at least two flexible thin-film substrates, referred to as flexible substrates hereinafter as well as a corresponding contact arrangement. The invention is distinguished by the to-be-joined flexible substrates, which each are provided with at least one opening at the point of connection being positioned in such a manner that the opening of one flexible substrate is congruent with the opening of another flexible substrate, by a bonding element being positioned on both sides of each congruently aligned opening, and by both the bonding elements being joined to a bonding connection by being pressed against each other and at least partially enclosing the peripheral edges of the openings facing said bonding elements.
REFERENCES:
patent: 4962416 (1990-10-01), Jones et al.
patent: 5235235 (1993-08-01), Martin et al.
patent: 2003/0150477 (2003-08-01), Suzuki
patent: 3512237 (1985-12-01), None
patent: 3703694 (1988-08-01), None
patent: 4131413 (1992-10-01), None
patent: 19831876 (1999-02-01), None
Beutel Hans-Jorg
Haberer Werner
Schuttler Martin
Burns Doane , Swecker, Mathis LLP
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung
Harrison Monica D.
Thompson Craig A.
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