Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1993-07-28
1997-02-18
Chapman, Mark A.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430323, 430324, 430325, 430326, 430394, G03C 500
Patent
active
056040814
ABSTRACT:
A method for producing relief surface structures comprises the step of providing a photoresist layer having a relief surface structure on a surface of a substrate, the relief structure of the photoresist layer being like the surface relief structure desired on the substrate, then removing the photoresist layer with an erosion process that erodes both the photoresist layer as well as the substrate material which is free of the photoresist layer or becomes free of the photoresist layer. To obtain the relief surface structure in the photoresist layer, the layer can be exposed with different amounts of exposure and then developed to form the relief structure
REFERENCES:
patent: 3875026 (1975-04-01), Widmer
patent: 4343890 (1982-08-01), Phillips et al.
patent: 4642163 (1987-02-01), Greschner et al.
patent: 4842969 (1989-06-01), Kawatsuki et al.
patent: 4857383 (1989-08-01), Greschner et al.
patent: 4895790 (1990-01-01), Swanson et al.
patent: 5213916 (1993-05-01), Cronin et al.
patent: 5279924 (1994-01-01), Sakai et al.
patent: 5434026 (1995-07-01), Takatsu et al.
Abstract of Japanese 02-238636, Patent Abstracts of Japan, vol. 14, No. 553 (E-1010), 7 Dec. 1990.
Abstract of Japanese 62-001232, Patent Abstracts of Japan, vol. 11, No. 165 (E-510), 27 May 1987.
Webster's II New Riverside University Dictionary, p. 441.
Katzschner et al, "Reactive Ion Beam Etching of InP with N.sub.2 and N.sub.2 O.sub.2 Mixtures", Appl. Phys. Lett., vol. 48, No. 3, 20 Jan. 1986, pp. 230-232.
Chapman Mark A.
Siemens Aktiengesellschaft
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