Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1993-05-05
1997-06-03
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430314, 430317, 430313, 430324, 430329, 438948, 216 47, 216 18, G03F 700
Patent
active
056353375
ABSTRACT:
A structure of openings is produced in two or more layers of silylated, polyimide photoresist. Openings in subsequent layers, which overlap previous openings, are of larger size. Then the structure is transferred to an organic substrate using oxygen plasma etching with up to 3% CF.sub.4. The smallest opening transferred to the substrate extends through the substrate.
REFERENCES:
patent: 3518084 (1970-06-01), Barson
patent: 5266446 (1993-11-01), Chang
IBM Technical Disclosure, vol. 33 No. 2, Jul. 1990, pp. 447-449, "Dual-Image Resist for Single-Exposure Self-Aligned Processing".
IBM Technical Disclosure Bulletin, vol. 32, No. 8A, Jan. 1990, pp. 218-219, "Method to Incorporate Three sets of Pattern Information in Two Photomasking Steps".
Bartha Johann
Greschner Johann
Probst Karl H.
Schmid Gerhard
Belk Michael E.
Duda Kathleen
International Business Machines
LandOfFree
Method for producing a multi-step structure in a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing a multi-step structure in a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a multi-step structure in a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-390452