Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-04-26
2005-04-26
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S289000, C438S290000
Reexamination Certificate
active
06884688
ABSTRACT:
A MOS transistor includes a drain zone, a source zone, and a gate electrode. Doping atoms of the first conductivity type are implanted in the region of the drain zone and the source zone by at least two further implantation steps such that a pn junction between the drain zone and a substrate region is vertically shifted and a voltage ratio of the MOS transistor between a lateral breakdown voltage and a vertical breakdown voltage can be set.
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Warren R. Anderson et al., ESD Protection for Mixed-Voltage I/O Using NMOS Transistors Stacked in a Cascode Configuration, Proceedings of the EOS/ESD Symposium 1998, pp. 54-63.*
Warren R. Anderson et al.: “ESD protection for Mixed-Voltage I/O Using NMOS Transistors Stacked in a Cascade Configuration”,Proceedings of the EOS/ESD Symposium 1998, pp. 54-63.
Esmark Kai
Gossner Harald
Mackh Gunther
Owen Richard
Zängl Franz
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
Wilczewski M.
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