Method for processing wafer-shaped substrates

Details Method for processing wafer-shaped substrates Method for processing wafer-shaped substrates

1995-03-13

1995-10-24

Werner, Frank E.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

414937, 414941, 414416, 414627, B65G 100

Patent

active

054604788

ABSTRACT:
An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.

REFERENCES:
patent: 3832836 (1974-07-01), Chenty et al.
patent: 4695215 (1987-09-01), Jacoby et al.
patent: 5372471 (1994-12-01), Wu

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