Cleaning and liquid contact with solids – Processes – Combined
Reexamination Certificate
2006-05-16
2006-05-16
Markoff, Alexander (Department: 1746)
Cleaning and liquid contact with solids
Processes
Combined
C134S001000, C134S001300, C134S113000, C134S0570DL, C134S902000
Reexamination Certificate
active
07045019
ABSTRACT:
An invention is disclosed for backside particle removal during a semiconductor manufacturing process. Cleaning sites are defined on the backside of a wafer. The cleaning sites are regions of the backside of the wafer that physically contact a chuck during a semiconductor fabrication process. Once the cleaning sites are defined, the backside of the wafer is cleaned, where the cleaning is primarily directed to the cleaning sites. Typically, the contact regions can correspond to pin positions of a chuck pin array, or wafer contact areas on a vacuum chuck. A laser or a megasonic wand can be used to provide the site-specific cleaning of the wafer backside.
REFERENCES:
patent: 5865901 (1999-02-01), Yin et al.
patent: 5963315 (1999-10-01), Hiatt et al.
patent: 6394105 (2002-05-01), Boszormenyi et al.
Boyd John M.
Hemker David J.
Lam Research Corporation
Markoff Alexander
Martine & Penilla & Gencarella LLP
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