Method for performing chemical shrink process over BARC...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C438S702000, C438S703000

Reexamination Certificate

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07083898

ABSTRACT:
A structure and a method for forming the same. The method includes providing a structure including (a) a hole layer, and (b) a pattern transfer layer on and in direct physical contact with the hole layer, wherein the pattern transfer layer comprises a pattern transfer layer hole; depositing an acid supply layer on a side wall of the pattern transfer layer hole; transferring acids from the acid supply layer to an acid storage region in the pattern transfer layer abutting the side wall of the pattern transfer layer hole after said depositing is performed; removing the acid supply layer after said transferring is performed; and performing a chemical shrinking process to the pattern transfer layer hole utilizing the acids from the acid storage region after said removing is performed so as to shrink the pattern transfer layer hole.

REFERENCES:
patent: 4707218 (1987-11-01), Giammarco et al.
patent: 6740473 (2004-05-01), Lin et al.
patent: 2005/0130067 (2005-06-01), Endo et al.
Kanda et al., “Advanced Microlithography Process with Chemical Shrink Technology”, Advances in resist Technology and Processing XVII, proceedings of SPIE vol. 3999 (2000) pp. 881-889.

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