Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-07-02
1993-10-12
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 1566591, 29611, 29620, 346 76PH, G01D 1510
Patent
active
052521826
ABSTRACT:
A method for processing a wiring fraction of on a heat-generating resistance of a thermal recording device, having different thicknesses at different regions are using a masking process or a dual exposing process, so that a height difference between the heat-generating resistance and the wiring is dualized and the contact pressure between a thermal recording paper and the heat-generating resistance is maximized, thereby enabling a high quality printing operation with low power consumption.
REFERENCES:
patent: 4973986 (1990-11-01), Narita
Bushnell Robert E.
Dang Thi
Samsung Electronics Co,. Ltd.
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