Method for manufacturing semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S478000, C438S491000, C438S510000, C438S514000, C438S520000, C438S525000, C438S528000

Reexamination Certificate

active

08039330

ABSTRACT:
The invention is directed to a method for manufacturing a semiconductor. The method comprises steps of providing a substrate having a gate structure formed thereon and forming a source/drain extension region in the substrate adjacent to the gate structure. A spacer is formed on the sidewall of the gate structure and a source/drain region is formed in the substrate adjacent to the spacer but away from the gate structure. A bevel carbon implantation process is performed to implant a plurality carbon atoms into the substrate and a metal silicide layer is formed on the gate structure and the source/drain region.

REFERENCES:
patent: 6268640 (2001-07-01), Park et al.
patent: 7060547 (2006-06-01), Chen et al.
patent: 2007/0037326 (2007-02-01), Chen et al.
patent: 2007/0254461 (2007-11-01), Wei et al.
patent: 2008/0070370 (2008-03-01), Wu et al.
patent: 480598 (2002-03-01), None
Chinese Examination Report of Taiwan Application No. 096101268, dated Dec. 22, 2009.
Chen et al., Removal of end-of-range defects in Ge+-pre-amorphized Si by carbon ion implantation, J. Appl. Phys., Mar. 15, 1999, pp. 3114-3119, vol. 85, No. 6.
Tan et al., Influence of substitutional carbon incorporation on implanted-indium-related defects and transient enhanced diffusion, Appl. Phys. Lett, Nov. 17, 2003, pp. 4169-4171, vol. 83, No. 20.
Tan et al., Leakage Suppression of Gated Diodes Fabricated Under Low-Temperature Annealing With Substitutional Carbon Si1-yCy Incorporation, IEEE Electron Device Letters, Apr. 2005, pp. 252-254, vol. 26, No. 4.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4278447

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.