Method for manufacturing semiconductor device

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S768000, C438S787000

Reexamination Certificate

active

07049248

ABSTRACT:
The present invention discloses a method for manufacturing semiconductor device wherein a cleaning process of a buffer layer is performed prior to a formation of a nitride film. The cleaning process allows to maintain the deposition thickness of the nitride film even when the time between the formation of the buffer layer and the formation of the nitride film is long.

REFERENCES:
patent: 5936300 (1999-08-01), Sasada et al.
patent: 6010936 (2000-01-01), Son
patent: 6037204 (2000-03-01), Chang et al.
patent: 6074919 (2000-06-01), Gardner et al.
patent: 6083795 (2000-07-01), Liang et al.
patent: 6180543 (2001-01-01), Yu et al.
patent: 6232164 (2001-05-01), Tsai et al.
patent: 6294448 (2001-09-01), Chang et al.
patent: 6626967 (2003-09-01), Takami et al.
patent: 6683356 (2004-01-01), Tsuchiaki
patent: 6858543 (2005-02-01), Lee et al.
patent: 03-046224 (1991-02-01), None
patent: 03-276718 (1991-12-01), None

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