Method for manufacturing printed circuit board with thin...

Details Method for manufacturing printed circuit board with thin... Method for manufacturing printed circuit board with thin...

2007-02-01

2009-02-03

Smith, Matthew (Department: 2823)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

Reexamination Certificate

active

07485411

ABSTRACT:
In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.

REFERENCES:
patent: 5261153 (1993-11-01), Lucas
patent: 6541137 (2003-04-01), Kingon et al.
patent: 2005/0011857 (2005-01-01), Borland et al.
patent: 2007/0004165 (2007-01-01), Shin et al.
patent: 2007/0152773 (2007-07-01), Oakes et al.

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