Method for manufacturing patterned thin-film layer

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

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Reexamination Certificate

active

08048617

ABSTRACT:
A method for manufacturing a patterned thin-film layer according to one preferred embodiment includes the steps of: providing a substrate with a plurality of banks thereon, the plurality of banks defining a plurality of spaces therein for receiving ink therein, each of the banks having a top surface and a plurality of side surfaces adjacent to the top surface; irradiating the plurality of banks with UV light beams, wherein the UV light beams are obliquely incident on the top surfaces of the substrate such that a surface wettability of the ink on the top surfaces is lower than that of the side surfaces of the banks; applying ink into the spaces; and curing the ink so as to form a patterned thin-film layer on the substrate.

REFERENCES:
patent: 2001/0006761 (2001-07-01), Golz et al.
patent: 2002/0008916 (2002-01-01), Nishikawa et al.
patent: 2004/0247790 (2004-12-01), Moriyama
patent: 200404183 (2004-03-01), None
patent: I228178 (2005-02-01), None
patent: 200619690 (2006-06-01), None

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